| 型号 | 品牌 | 封装 | 数量 | 描述 | 参数 | PDF资料 |
|---|---|---|---|---|---|---|
| HS26 | Cirrus Logic Inc | 87 | HEATSINK OPEN FRAME 0.5C/W | ... | ||
| HS27 | Apex Microtechnology | 88 | HEATSINK 12P PWR SIP | ... | ||
| HS28 | Apex Microtechnology | HEATSINK SIP | ... | |||
| HS29 | Cirrus Logic Inc | 5 | HEATSINK 12P TO220 2.7C/W | ... | ||
| HS31 | Apex Microtechnology | HEATSINK OPEN FRAME | ... | |||
| HS32 | Apex Microtechnology | HEATSINK SIP 1.33C/W | ... | |||
| HS33 | Cirrus Logic Inc | 71 | HEATSINK FOR DK AND HQ PACKAGES | ... | ||
| HSCCS-CALBL-001 | Nuventix | 176 | HEATSINK 40W CHIP 30 AL BLACK | ... | ||
| HSCCS-CALCL-001 | Nuventix | LOW PROFILE CHIP COOLER HEATSINK | ... |
